金十数据
金十数据|6月 17, 2026 06:44
LG Innotek’s packaging solutions head said on the 16th the company will invest 1 tln won to build a semiconductor substrate plant in Vietnam as the first phase of expanding its packaging substrate business. It is negotiating a second-phase investment to enlarge FCBGA capacity for AI servers; discussions have made substantive progress and the company expects to announce scale soon. LG Innotek also plans additional FCBGA expansion at its Gumi, North Gyeongsang factory in South Korea beyond a previously announced 600 bln won investment, scaling production according to customer-agreed volumes.(金十数据)
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