[Elon Musk Responds to Sell-Off in Memory Chip Stocks: China's Manufacturing Capacity Often Surpasses the Rest of the World Combined After Mastering the Technology] BlockBeats News, October 13 – In response to discussions about the sell-off in memory chip stocks, Elon Musk stated that once China masters the manufacturing technology for a certain product, its capacity to scale production often surpasses the rest of the world combined. This has already been observed in the lithium battery and solar energy sectors. He noted that the memory industry might be different, but about three years ago, memory was still a low-margin commodity. LP5 and LP6 follow general standards, and China appears to be rapidly overcoming the related technical challenges. However, next-generation HBM architectures, as well as technologies like placing SRAM layers beneath logic circuits, stacking 3D memory on top, and simultaneously addressing heat dissipation in logic circuits, will be more difficult to overcome. Musk also mentioned that SpaceX is a rare exception, with the total mass of payloads it has sent into orbit exceeding the rest of the world combined by about an order of magnitude. However, outside of SpaceX, China already accounts for the majority of the total payload mass sent into orbit. Previously, it was reported that Changxin Memory Technologies announced a key breakthrough in the development of the next-generation DRAM 4F² architecture, with plans to launch DDR5 RDIMM server memory products incorporating this architecture and hybrid bonding technology by the end of the year. Compared to the mainstream 6F² architecture, 4F² theoretically reduces cell area by about one-third, increasing storage density by approximately 50% on the same wafer area and process node. This has heightened concerns in the market about future competition and supply expansion. [Original Link]