[NVIDIA and Cisco Launch New Pluggable Optical Module Form Factor to Expand AI Factories] NVIDIA and Cisco have jointly introduced a new pluggable optical module form factor, USFP (Ultra Dense Small Form-factor Pluggable), aimed at expanding the network scale of AI factories. USFP is the first module to support 400Gb/s electrical signals per channel, with a single module capacity of up to 12.8Tb/s. This allows AI builders to connect more computing systems without adding network layers while reducing the power consumption per bit of data transmission. Compared to existing 200Gb/s-per-lane optical modules, USFP offers a 4x increase in bandwidth density and a 1.3x improvement in energy efficiency. NVIDIA and Cisco are collaborating with TE Connectivity and Amphenol to build a multi-source hardware ecosystem around USFP.