[Samsung Invests Nearly $5 Billion to Expand Semiconductor Substrate Production in South Korea and Vietnam] According to Deep Tide TechFlow, on October 7, Nikkei reported that Samsung Electro-Mechanics plans to invest nearly $5 billion by 2028 in South Korea and Vietnam for semiconductor substrate production, further enhancing Vietnam's role in the production of key components for AI servers and high-performance computing. As a subsidiary of South Korea's Samsung Group specializing in electronic components, Samsung Electro-Mechanics announced two FC-BGA (Flip Chip Ball Grid Array) substrate investment plans last week. These substrates are used in AI servers, robotics, and smart vehicle chips. One of the investments amounts to KRW 4.27 trillion ($3.2 billion) for the Sejong plant in South Korea, marking the company's largest single-product investment to date. The other investment, totaling KRW 2.51 trillion ($1.87 billion), is allocated to its subsidiary in Vietnam. The company had previously announced in 2022 that it would test FC-BGA substrates in Thai Nguyen Province, northern Vietnam. The expansion of this facility now indicates that the trial production results met expectations, and the company is ready to move into large-scale mass production.