[TSMC-Backed VIS's First Singapore Wafer Fab Reaches Full Capacity Upon Launch, Evaluating Second Project] Golden Finance reported on September 28 that TSMC-backed chip manufacturer VIS held an inauguration ceremony on Monday for its first advanced chip manufacturing plant in Singapore and is already planning the construction of a second facility. Driven by the surge in demand for AI infrastructure, the new plant's capacity was fully 'sold out' upon launch. The wafer fab, named VSMC, is a joint venture between VIS and European chip manufacturer NXP. The plant began trial production in June, taking only 18 months from groundbreaking to trial production—significantly faster than the typical two-plus years required to build a chip factory. VIS stated that the initial batch of chips achieved a yield rate of at least 99%. The plant is scheduled to begin mass production in early 2027. This facility will also assist TSMC in producing critical 'interposer layers' for advanced chip packaging, which serve as substrates connecting different types of chips, catering to leading AI chip manufacturers such as NVIDIA, Google, and Broadcom. TSMC is VIS's largest shareholder, holding approximately 19% of the company.