深潮TechFlow
深潮TechFlow|Sep 23, 2026 02:46
[SoftBank Launches Massive High-Yield Bond Issuance to Advance AI Deployment] Deep Tide TechFlow reports that on September 23, documents reveal SoftBank Group plans to issue $1 billion in 3.5-year bonds, $4.5 billion in 5.5-year bonds, and $4.5 billion in 7.5-year U.S. dollar bonds. (Jin10)
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