[Lens Technology: Memorandum of Understanding Signed with Intel] Lens Technology announced that its wholly-owned subsidiary, Lens International (Hong Kong) Co., Ltd., recently signed a Memorandum of Understanding (MoU) with Intel Corporation. The MoU primarily discusses the intent and preliminary arrangements for collaboration between the two parties in the field of Through-Glass Via (TGV) advanced packaging. This includes key processes such as glass substrate perforation, high-precision laser processing, metallized via deposition, and multilayer interconnect wiring. The two parties will engage in discussions and evaluations regarding potential cooperation, with Intel providing relevant architecture information, design for manufacturability guidelines, benchmarking methods, and validation methods. The MoU is valid for one year from the date of signature by the authorized representatives of both parties and may be extended upon mutual agreement before expiration.