Memory Analyst: ChangXin Memory vs SK Hynix, still 3 years behind! ChangXin plans to mass-produce HBM3 this year, HBM3E next year, while SK Hynix is already sampling HBM5 in 2027. The gap is indeed 3 years. SK Hynix and Samsung are using the most advanced ASML lithography machines. Although China secretly got one, it’s definitely not the latest version. But in the long run, 5-10 years, we can absolutely catch up. Competing is what China does best. ChangXin can live tough, but they can’t stand watching SKHY driving a Range Rover