[Renowned U.S. Stock KOL: Severe Capacity Bottlenecks and Significant Yield Issues with CPO] BlockBeats News, June 10, U.S. stock KOL Herman Jin (@ShanghaoJin) responded on social media to the statement that 'only Intel's (INTC) EMIB packaging technology can truly achieve CPO (Co-Packaged Optics), while TSMC's (TSMC) CoWoS technology cannot,' saying: 'CPO currently faces severe capacity bottlenecks and too many yield (finished product rate) issues. Everyone, please calm down and don't be overly optimistic.' [Original Link]