[Huawei Introduces the Semiconductor Tao (τ) Law] According to a report by Jinse Finance on May 25, citing the People’s Daily, the 2026 International Symposium on Circuits and Systems was held on the 25th in Shanghai. During the keynote speech titled 'Exploration and Practice of New Paths in Semiconductors,' He Tingbo, Huawei's Director and President of the Semiconductor Business Unit, officially introduced the 'Tao (τ) Law.' This marks the first time China has proposed a new principle to guide industry development in the global semiconductor field. Based on this law, Huawei has successfully designed and mass-produced 381 types of chips over the past six years. This fall, Huawei will release a new Kirin smartphone chip that fully adopts logic folding technology, significantly enhancing related performance. The 'Tao Law' proposes replacing 'geometric scaling' with 'time scaling,' aiming to systematically reduce the time constant (Tao τ). Through innovative technologies such as logic folding, it continuously compresses signal propagation delays, increases transistor density, and enables the ongoing evolution of semiconductors and electronic systems. The 'Tao Law' establishes a multi-level collaborative optimization framework spanning devices, circuits, chips, and system layers. By 2031, high-end chip transistor density based on this law is expected to reach the equivalent level of a 1.4-nanometer process.