[SK Hynix Advances EUV Process, Introduces New Material PSM] According to DeepTech TechFlow, on August 11, as reported by the Financial Associated Press, SK Hynix is actively advancing its extreme ultraviolet lithography (EUV) technology to achieve mass production of next-generation DRAM. The company first introduced high numerical aperture (High-NA) EUV equipment last year and has fully launched the development of related technologies this year. It is reported that the company has begun the comprehensive adoption of new materials such as phase shift masks (PSM) to enhance EUV lithography performance.