[Samsung Electronics Considering Outsourcing Google 2nm TPU I/O Die Backend Design] Odaily Planet Daily reports that Citrini analyst Jukan posted on the X platform stating that Samsung Electronics is considering outsourcing the backend design work for Google’s 10th-generation 2nm TPU 'Icefish' I/O Die and has already inquired about requirements from design solution partners. This TPU is used to run Google’s AI models, including Gemini. Reportedly, Google is co-designing this chip with MediaTek, with mass production planned as early as 2028. The TPU consists of a compute processor and an I/O Die, with the compute processor expected to be manufactured by TSMC using a 1.4nm process, and the I/O Die manufactured by Samsung Electronics using a 2nm process. Samsung Electronics has reportedly secured 2nm customers beyond Google and Tesla, including Anthropic and DeepX. ADTechnology, Gaonchips, and Alphachips are mentioned as potential outsourcing contractors. Among them, ADTechnology is focusing on the 2nm CPU project 'ADP620,' aiming for annual revenue exceeding 1 trillion KRW between 2028 and 2029. Gaonchips is preparing to participate in the South Korean Ministry of Trade, Industry, and Energy’s 'K-On-Device AI' project, valued at approximately 800 billion KRW. Alphachips is said to view the Google TPU project as a growth driver and is participating more actively.