[NetEase-Incubated Qianhe Yibang Successfully Lights Up the World's First 4-Layer 3D DRAM Stacked Compute-in-Memory Chip] DeepTech TechFlow reports that on August 21, 3D compute-in-memory chip company Qianhe Yibang announced that its self-developed world's first 4-layer 3D DRAM stacked compute-in-memory chip has successfully returned from fabrication and been powered on, marking the transition of this technology from validation to the engineering implementation stage. The chip adopts a three-dimensional integrated native computing architecture, achieving an order-of-magnitude improvement in data access bandwidth compared to traditional solutions, while reducing access power consumption, latency, and per-data processing cost by an order of magnitude. Qianhe Yibang was founded in January 2024, incubated by NetEase, and recently completed a Series B financing round exceeding 2 billion yuan.