**[Huawei Launches the World's First 3D Data Center]** Huawei today unveiled the world's first 3D data center, released the monograph *3D Data Center*, and opened the *3D Data Center Conceptual Design Library*. The 3D data center draws inspiration from the strict separation of the "power layer" and "production layer" in chip factories, vertically stacking the functional spaces of traditional horizontally deployed data centers. This forms a four-layer architecture consisting of a cooling supply layer, IT equipment layer, power supply layer, and backup power layer from bottom to top. Huawei's Vice Chairman and Rotating Chairman, Wang Tao, stated that the demand for AI infrastructure is rising due to large-scale models with trillions of parameters and the rapid growth of token requirements. Ascend ultra-node clusters with over 100,000 cards will become the standard configuration. The 3D data center, through layered decoupling and vertical stacking, supports the supercomputing power factory of Ascend ultra-node clusters. (*Sci-Tech Innovation Board Daily*)