Qualcomm and Amazon Forge Multi-Generation Partnership to Advance AI Data Center Custom Chips

DeepTech TechFlow reports that on September 8, Qualcomm (QCOM.O) announced a multi-generation partnership with Amazon (AMZN.O) to provide customized chips for large-scale AI data centers and jointly advance AI inference. The two parties are also collaborating on the development of optical interconnect solutions with speeds up to 1.6T and future generations. Qualcomm plans to deepen its use of AWS AI infrastructure (including Amazon Bedrock) for electronic design automation (EDA) workloads, aiming to shorten chip design cycles. Qualcomm President and CEO Cristiano Amon stated that with the accelerating demand for AI, data center infrastructure requires breakthroughs in both computing and connectivity. Qualcomm is pleased to collaborate with AWS on customized chips and connectivity solutions. AWS Vice President Prasad Kalyanaraman noted that this partnership builds on a strong foundation of collaboration, with a shared commitment to providing customers with more efficient and cost-effective infrastructure. (Jin10)