TSMC - the world's largest chipmaker - is accelerating the establishment of its local DRAM supply chain, with Taiwan's Winbond. The collaboration between TSMC and Winbond is in the field of advanced 3D wafer-on-wafer (WoW) stacking technology. Winbond's technology and mass production capabilities have been favored, and it will provide DRAM and other memory wafers to be stacked together with TSMC's logic process wafers https://money.udn.com/money/story/5612/9594197?from=ednappsharing(zerohedge)