[Renowned Analyst: TSMC's Next-Generation Advanced Packaging Technology Expected to Enter Mass Production in the Second Half of 2028] BlockBeats News, June 11 — Hong Kong-based TF International Securities analyst Ming-Chi Kuo stated in a post that TSMC's next-generation advanced packaging technology, CoPoS, is expected to enter mass production in the second half of 2028. It is specifically designed for ultra-large packages exceeding 9.5 times the photomask size, with NVIDIA's Hopper AI chips likely to be the first adopters. CoPoS utilizes a glass core substrate structure, sandwiching glass between ABF build-up layers and using glass carriers and panels of specific dimensions. It is neither a glass interposer nor a replacement for ABF; instead, the chips are bonded to the ABF surface, clarifying several industry misconceptions. Publicly available information indicates that CoPoS offers a larger panel platform and space, making it highly suitable for integrating CPO optical components (such as optical engines and couplers). In the future, high-end AI packaging may simultaneously adopt CoPoS (large substrates) + CPO (optical I/O) to form a complete solution. [Original Link]