NVIDIA CEO Jensen Huang comments on Huawei's Tao's Law and its new chip technology: '3D chip packaging and hybrid bonding technology have been around for about ten years. TSMC has a certain foundation in this technology. Using die stacking and bonding technology is a great approach. Huawei's use of this technology to increase the number of transistors by 2x or even 3 to 4x is an excellent technology!'