[Samsung Accelerates Development of 3D Cube-H Advanced Packaging, Aiming for Completion by Early 2027] According to a report by ZDNet on November 10th, Samsung Electronics plans to complete the development of its next-generation advanced packaging technology, 3D Cube-H, by early 2027 and launch its first design toolkit, followed by evaluation of potential customers. This technology uses hybrid bonding, achieving vertical chip stacking through direct copper-to-copper connections. The target interconnect pitch is approximately 6 micrometers, significantly smaller than the approximately 25-micrometer minimum pitch of Samsung's existing thermo-compression bonding (TC Bonding). Compared to traditional technologies, hybrid bonding can increase chip connection density, improve heat dissipation, and reduce data transmission power consumption, making it suitable for high-performance AI chips, GPU stacking, and logic chip and HBM integration. Samsung hopes to enhance its advanced packaging competitiveness and create conditions for winning AI chip foundry orders from large technology companies.