[TSMC Considers Manufacturing New 3D DRAM Memory Chip] According to Jinse Finance on November 8th, TSMC, the world's largest chip foundry, is considering expanding into the memory manufacturing field. It is understood that TSMC recently began formulating an advanced memory chip production plan, considering manufacturing a new type of memory chip called 3D DRAM. This plan was initiated at the request of its largest customer, Nvidia, and aims to expand TSMC's business share in the AI hardware supply chain. Sources familiar with the matter said that TSMC is evaluating two options: building a new factory or acquiring an existing semiconductor factory and converting it into memory chip production facilities. The mass production timeline has not yet been determined. The project is being led by Xu Guojin, Vice President of TSMC responsible for advanced packaging business. The 3D DRAM that TSMC is considering developing, which increases storage density through vertically stacked memory cells, is expected to become the development direction of next-generation DRAM technology.