[NVIDIA Unveils Next-Generation CPO Technology; Prototype Samples Available] According to Jinse Finance, NVIDIA recently showcased its next-generation co-packaged optics (CPO) technology, named OOI (Optics-on-Interposer), at SEMICON West 2026. Unlike existing CPO solutions, OOI removes the organic packaging substrate, directly integrating the optical engine onto the silicon interposer that houses the GPU. This brings the photoelectric conversion process closer to the chip core, providing a new interconnection approach for next-generation hyperscale AI clusters. According to Nikola Nedovic, Principal Research Scientist at NVIDIA Research, this solution replaces the current organic packaging substrate with a larger interposer, and NVIDIA has already received prototype samples.