[TSMC Reportedly Plans to Raise Advanced Packaging Prices by 10% to 20%, Putting Cost Pressure on Nvidia and AMD] BlockBeats reported on October 27th, citing supply chain sources, that TSMC is considering raising its advanced packaging service prices by 10% to 20%, primarily affecting its CoWoS packaging technology used in high-end AI chips. If the price increase is implemented, chip manufacturers such as Nvidia and AMD will face upward pressure on production costs. CoWoS integrates chips with high-bandwidth memory (HBM) in a single package and is a key process for high-end AI acceleration chips. As demand expands from GPUs to server CPUs and custom AI chips (ASICs), advanced packaging capacity continues to tighten. The report predicts that TSMC's monthly CoWoS capacity will exceed 130,000 wafers in 2026 and is expected to further increase to over 200,000 wafers in 2027. Even with continued capacity expansion, increased demand may still drive up packaging prices. If costs rise, manufacturers heavily reliant on CoWoS, such as Nvidia, may face pressure on profit margins, and customers like Apple may also be indirectly affected by increased supply chain costs. However, the proposed price increase is currently still under consideration. [Original Link]