[Bank of America, Blackstone, and Three Other Institutions Provide $63 Billion Financing to Anthropic for Broadcom Chips] According to a joint announcement by Bank of America, Blackstone, Citigroup, and Morgan Stanley, the four institutions will establish a $63 billion financing structure to support the construction of AI computing power capacity. Under the arrangement, a newly established special purpose vehicle (SPV) will purchase Broadcom's XPU AI accelerators and network solutions and lease them to Anthropic. Bank of America, Citigroup, and Morgan Stanley will arrange the first lien financing, Blackstone will be the sole contributor to the second lien portion, and Broadcom will provide residual value support to the SPV equivalent to the first lien financing amount. This transaction is part of Broadcom's previously announced strategic computing power agreement, with deliveries expected to begin in 2027.