SK Hynix abandons Solidigm US IPO plan, regulatory and shareholder pressures become important factors On October 23rd, according to the Wall Street Journal, SK Hynix has officially halted the US IPO plan of its storage chip wafer company Solidigm and terminated the Pre IPO financing work that was synchronized with the IPO. The company stated that this decision is mainly based on the recent capital market environment and stock price trends, and does not represent any changes in Solidigm's business prospects or investment needs. Solidigm has previously selected Goldman Sachs and Morgan Stanley as potential lead underwriters for its IPO, with plans to list on NASDAQ as early as 2027, with a valuation of up to $150 billion. South Korean regulatory authorities have recently determined that the listing plan may be subject to restrictions on "duplicate listings", and existing shareholders of SK Hynix are also concerned that the independent listing of its subsidiary will dilute the shareholder value of the parent company.