[Central Bank: Enhancing the Bond Market's Role in Supporting Technological Innovation] Golden Finance reports that the People's Bank of China and several other departments have jointly issued the 'Guiding Opinions on Financial Support for the Construction of International Science and Technology Innovation Centers in Beijing (Beijing-Tianjin-Hebei), Shanghai (Yangtze River Delta), and the Guangdong-Hong Kong-Macao Greater Bay Area.' Market institutions are encouraged to create technology innovation bond index products to provide diversified asset allocation tools in the field of technological innovation. The use of credit risk mitigation warrants (CRMW), credit protection tools, and other mechanisms is encouraged to support the issuance and investment of technology innovation bonds. Efforts will be made to leverage tools for risk-sharing in technology innovation and private enterprise bonds, as well as policies supporting private enterprise bond risk-sharing mechanisms, to provide guarantees and credit enhancements for bond financing by eligible private technology enterprises and private equity investment institutions. Local governments are encouraged to establish comprehensive service windows or platforms for the issuance of technology innovation bonds, offering integrated 'one-stop' services such as promotional roadshows and credit enhancement empowerment. Support will also be given to research and develop industry standards for credit ratings of technology innovation bonds.