[Korean Media: Samsung to Use TSMC Technology to Produce Next-Generation Memory Chips for NVIDIA] Golden Finance reported on October 18 that, according to a Sunday report by the Seoul Economic Daily, Samsung Electronics will adopt TSMC's 3nm process technology to produce base dies for NVIDIA's next-generation custom HBM chips. This move will mark Samsung's first collaboration with TSMC during the HBM manufacturing phase. The newspaper, citing industry sources, stated that NVIDIA has requested Samsung, SK Hynix, and Micron Technology to use TSMC's process to manufacture NVHBM base dies and to utilize sixth-generation DRAM technology to produce its core chips. According to the company, the NVHBM, released in August this year, integrates NVIDIA's custom memory controller into the substrate, aiming to achieve standardized implementation across multiple memory suppliers. The Seoul Economic Daily reported that Samsung, after internal evaluation, has accepted NVIDIA's request but plans to continue using its own production model to manufacture standard HBM as well as custom products for other clients. The newspaper also cited sources saying that Samsung is evaluating whether its own foundries could produce NVHBM base dies if demand exceeds TSMC's capacity.