[SK Hynix Expands Outsourcing Scale for Storage Semiconductor Flip Chip Packaging] According to Golden Finance, on September 30, SK Hynix expanded the outsourcing scale for storage semiconductor flip chip packaging. Following OSAT (Outsourced Semiconductor Assembly and Test) supplier A-PROTECH, SK Hynix has begun outsourcing more business to WINPAC, marking the first collaboration between the two companies in four years. SK Hynix plans to outsource part of its DDR4 and DDR5 DRAM memory chip packaging orders to WINPAC. WINPAC has completed equipment debugging and production line preparations at its packaging factory in the P Zone and has now entered the mass production stage. The P Zone is responsible for packaging high-performance products such as DRAM, NAND flash, and eAmerica embedded universal flash memory, with monthly production capacity increased from 44 million units to 50 million units.