[Strong Demand for AI: TSMC-Backed VIS's First Singapore Wafer Plant Reaches Full Capacity Upon Launch] According to DeepTech TechFlow, on September 28, as reported by Nikkei Asia, TSMC (TSM.N)-backed chip manufacturer VIS held an inauguration ceremony on Monday for its first advanced chip manufacturing plant in Singapore, which has already begun planning for a second facility. Driven by the surge in demand for AI infrastructure, the new plant's capacity was fully 'sold out' upon commissioning. The wafer plant, named VSMC, is a joint venture between VIS and European chip manufacturer NXP. The facility began trial production in June, completing construction to trial production in just 18 months—significantly faster than the typical two-plus years required to build a chip plant. VIS stated that the yield rate of the first batch of chips has reached at least 99%. The plant is scheduled to begin mass production in early 2027. This facility will also assist TSMC in producing critical 'interposer layers' for advanced chip packaging, which serve as substrates connecting different types of chips, catering to leading AI chip manufacturers such as NVIDIA, Google, and Broadcom. TSMC is VIS's largest shareholder, holding approximately 19% of the company. (Jin10)