星球日报
星球日报|Sep 18, 2026 12:50
[SoftBank Plans to Issue Another $10 Billion to $20 Billion in Bonds Next Week to Boost AI Financing Power] Odaily Planet Daily News: SoftBank Group is finalizing potential new borrowings of nearly $21 billion this week to expand its financing capacity in the AI sector. According to insiders, SoftBank has increased the margin loan secured by shares of its chip subsidiary Arm Holdings by $5 billion to $25 billion and added $450 million to its existing credit line, bringing the total credit limit to $6.5 billion. Additionally, SoftBank plans to raise another $10 billion to $20 billion next week through a massive bond issuance. (Bloomberg)
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