[Qualcomm and Amazon Reach Multi-Generation Collaboration to Promote Custom AI Data Center Chips] According to Jinshi News, Qualcomm (QCOM.O) announced today a multi-generation collaboration with Amazon (AMZN.O) to provide customized chips for large-scale AI data centers and jointly advance AI inference. The two parties are also co-developing optical interconnect solutions with capacities up to 1.6T and for future generations. Qualcomm plans to deepen its use of AWS AI infrastructure (including Amazon Bedrock) for electronic design automation (EDA) workloads, aiming to shorten chip design cycles. Qualcomm President and CEO Cristiano Amon stated that with the accelerated demand for AI, data center infrastructure requires breakthroughs in both computing and connectivity. Qualcomm is pleased to collaborate with AWS on customized chip and connectivity solutions.