[Samsung Opens Advanced Chip Packaging R&D Center in Japan] According to Deep Tide TechFlow, on September 8, Samsung Electronics launched an advanced semiconductor packaging R&D facility in Yokohama, Japan. Samsung previously announced plans to invest approximately 40 billion yen over five years starting in 2024 to expand the laboratory's research hardware capabilities and strengthen its expertise in advanced packaging technologies. This advanced packaging laboratory will collaborate with local Japanese companies, universities, and research institutions to develop next-generation packaging materials and processes. Samsung plans to expand the research team at this facility to over 100 members by 2027. (Jin10)