[Micron Plans Significant HBM Capacity Expansion This Year, Expected to Double] Odaily Planet Daily News – Micron plans to make large-scale equipment investments by the end of the year to enhance the supply capacity of its latest generation HBM—HBM4 12-layer products. This move aims to address its shortcomings in HBM capacity compared to Samsung Electronics and SK Hynix, thereby increasing its market share. Micron plans to add up to 60,000 wafers per month of HBM capacity (measured by wafers) by the end of this year. Last year, Micron's HBM production was approximately 40,000 to 50,000 wafers per month. Based on this calculation, Micron's HBM capacity will more than double compared to last year. An industry insider familiar with the matter stated: 'Micron is making large-scale equipment investments to rapidly enhance the production capacity of HBM4. By the end of this year, Micron is expected to have an HBM capacity of approximately 100,000 wafers per month.' (Korea ETNews)