TSMC Incorporates Microchannel Cooling Technology into R&D Blueprint

Golden Finance reported on September 3 that TSMC has included the next-generation "Microchannel" cooling technology in its R&D blueprint. Previously, there were reports that NVIDIA intended to adopt microchannel cooling technology, but due to its high technical difficulty, it has yet to be implemented. With TSMC taking the lead, microchannel cooling is expected to become the new favorite in the industry. Industry insiders predict that NVIDIA may introduce microchannel cooling technology in its next-generation Feynman platform. TSMC will also collaborate with major clients on technology upgrades and begin investing in related R&D to address the issue of skyrocketing power consumption caused by the doubling of transistor counts and significant increases in computing power. At that time, the power consumption of a single chip may even exceed 4,000 watts, and traditional water-cooling plates may struggle to meet cooling demands. Chen Yanming, Director of Advanced Packaging R&D at TSMC, stated that microchannel cooling technology improves heat transfer efficiency by setting up microfluidic channels within the chip or packaging structure, allowing the coolant to get closer to the heat source. (Jin10)