[Deutsche Bank: 'Memory Wall' Forcing AI Chips to Change Course] According to a report by Jinse Finance, Deutsche Bank pointed out that the persistent 'Memory Wall' and tight memory supply have begun to impact the product roadmap for next-generation AI chips. Investors are discussing whether some new processors will reduce HBM configurations, while soaring DRAM prices are also being factored into the cost calculations of AI's total capital expenditures. Supply constraints are accelerating the emergence of new technological pathways, including inference chips that rely more on SRAM, custom HBM base dies, HBF, and other HBM variants. Deutsche Bank emphasized that related engineering solutions are currently in a phase of rapid change, with low visibility in the supply chain. However, most management teams believe the current issues are primarily centered around economics and costs, and overall DRAM demand is likely to remain high. This also adds a new perspective to the high prosperity of HBM: the tighter the supply and the higher the prices, the more favorable it is for memory manufacturers' short-term profitability, but it also increases the likelihood of customers seeking architectures that are more memory-efficient. In the next phase, in addition to monitoring HBM capacity and pricing, attention should also be paid to the single-chip HBM configurations of next-generation GPUs and ASICs, as well as whether alternatives like SRAM and HBF can truly achieve large-scale application. (Jin10)