[Kioxia and Sandisk Release World's Highest-Density 3D NAND Flash Memory with 332-Layer QLC Interface Speed of 4800MT/s] BlockBeats News, August 5: Kioxia and Sandisk officially unveiled their latest BiCS10 3D QLC NAND flash memory chip at the Future of Memory and Storage Conference (FMS), claiming it to be the highest storage density 3D NAND product currently available on the market. According to the announcement, the chip features a 332-layer stacked structure, achieving a storage density of 37 Gb/mm² per unit area. It is equipped with a high-speed interface of up to 4800 MT/s and supports Separate Command and Address (SCA) functionality, primarily targeting high-capacity data center-grade SSD markets. Compared to the previous BiCS10 3D TLC NAND products launched by the two companies, this new QLC NAND surpasses the storage density of 29 Gb/mm², further enhancing storage capacity density for data centers. Industry experts estimate that with similar chip sizes and storage cell counts, the capacity of this chip could reach approximately 1.33Tb, though the manufacturers have not yet disclosed specific capacity specifications. To meet the demand for high performance and low power consumption in data centers, Kioxia and Sandisk have also introduced Power Isolation-Low Tap Termination (PI-LTT) technology, which improves high-speed signal integrity while reducing output drive power consumption. The two companies stated that with the latest BiCS10 process technology, the new generation of QLC NAND not only achieves higher bit density but is also expected to reduce manufacturing costs as production scales up, enabling higher-capacity SSDs to enter the market at more competitive prices. [Original Link]