BTCBTC
💲64711.38
+
0.55%
ETHETH
💲1918.07
-
0%
SOLSOL
💲74.61
+
0.61%
XAUXAU
💲4106.40
+
0.49%
USDCUSDC
💲1.00
-
0%
BANKBANK
💲0.07038
-
55.85%

律动BlockBeats
律动BlockBeats|7月 30, 2026 13:20
[TSMC U.S. Stock Pre-Market Rises Over 4%, to Develop AI Chip Packaging Technology] BlockBeats News, July 30, according to BIT ((bit.com)) market data, TSMC U.S. stock pre-market rose over 4%. On the news front, TSMC (TSM.N) announced today that it will develop AI chip packaging technology.
+5
Mentioned
Share To

Timeline

7月 30, 15:20Base Ecosystem Fund supports builders developing on-chain products
7月 30, 10:17Amazon's internal AI project reportedly severely over budget
7月 30, 02:10The company has launched perpetual contracts overseas.
7月 29, 11:45Zuckerberg pushes for faster AI development
7月 29, 10:19Lithuanian AI car rental platform Sigvi raises €1.2 million in funding
7月 29, 04:051,178 top AI company employees call for international cooperation to control AI development
7月 28, 14:07Recruiting Blockchain Full-Stack Engineer (Solana + EVM Focus)
7月 28, 12:58Secret Network community releases L1 Continuation Proposal
7月 28, 09:47META and BlackRock will develop a data center campus in El Paso, Texas.
7月 28, 09:42Meta and BlackRock jointly invest in a data center campus

HotFlash

APP

X

Telegram

Facebook

Reddit

CopyLink

Hot Reads