[SemiAnalysis: Huawei HiSilicon Kirin 9030 Chip Surpasses Intel's Most Advanced EUV Process Without EUV Lithography Machines] Golden Finance reported on July 21 that a well-known semiconductor and AI research analysis company published an article stating that after disassembling Huawei's latest flagship smartphone chip, the HiSilicon Kirin 9030, they measured the smallest wire spacing—metal pitch—inside the Kirin 9030 under an electron microscope. The results revealed that the smallest metal pitch inside the Kirin 9030 is only 32.5 nanometers. This is smaller than the metal pitch of Intel's latest 18A process-based Panther Lake chip. Remarkably, SMIC managed to reduce the wire spacing to about 10% smaller than Intel's most advanced EUV process, despite lacking the most advanced equipment and EUV lithography technology.