Samsung Electronics Establishes BEOL Process Organization, Focuses on High-Value Memory like HBM4

Odaily Planet Daily News – Samsung Electronics' semiconductor division has recently formed a BEOL process organization within the etching technology team of its memory business unit. The organization is planned to be fully established this month and will begin operations at the Pyeongtaek campus, with an initial team of approximately 30 members. Most members of the organization are senior engineers, and their discussions will revolve around securing BEOL process technology for high-value memory such as HBM, optimizing personnel allocation, and strengthening supply chain operations. BEOL (Back-End-of-Line) refers to the metal wiring formation process in the later stages of semiconductor manufacturing, used to connect various devices on the wafer and transmit signals after the devices are formed. Samsung Electronics began shipping HBM4 earlier this year, which features 2,048 I/O connections—double the number of the previous generation. Increasing the number of I/O connections within a limited chip area requires denser wiring and narrower line widths, posing higher demands on metal wiring formation and etching precision. The organization is still in its early stages of formation, and its specific operational direction and objectives will be clarified later.