星球日报|Jul 14, 2026 12:48
[Chip Manufacturer Tower Semiconductor to Invest $3 Billion in Japan]
Odaily Planet Daily News - Chip manufacturer Tower Semiconductor announced on July 14 local time that it will invest $3 billion to enhance chip manufacturing in Japan, including a $1 billion grant from the Japanese government. According to the statement, the first phase will significantly increase the production capacity of 300mm silicon photonics devices, with full-scale production expected by the fourth quarter of 2027. This phase includes upgrading the existing Fab 6 facility to enable 300mm silicon photonics device production capacity and advanced packaging capabilities. The second phase will be launched simultaneously with the first phase and involves building a new 300mm lithography manufacturing plant next to the Fab 7 facility.
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