[Samsung and SK Hynix Delay Adoption of Hybrid Bonding Packaging Technology Due to Significantly Reduced Industry Urgency] According to a report by Jinse Finance on July 9, market sources indicate that Samsung Electronics and SK Hynix had originally planned to use hybrid bonding technology for HBM4 but are now reconsidering. Hybrid bonding is an advanced semiconductor packaging technology, initially expected to be applied to 16-layer HBM4E. The two companies have reportedly decided to continue using traditional thermal compression bonding technology due to the industry's relaxation of HBM thickness standards and delays in customer demand for high-stack adjustments.