[TSMC Reportedly Expanding PIC Capacity Significantly, Expected to Reach 25,000 Wafers Per Month by 2028] Golden Finance reports, July 8: According to institutional forecasts, TSMC's photonic integrated circuit (PIC) capacity is set to experience rapid growth. TSMC's capacity will increase from the current level of approximately 500 wafers per month to 10,000 wafers per month by Q2 2026, further rising to 15,000 wafers per month by Q4, and is expected to reach at least 25,000 wafers per month by 2028. Institutions estimate that if each wafer contains 648 dies, TSMC's annualized PIC output will surge from approximately 4 million dies to 78 million dies when monthly capacity increases from 500 wafers to 10,000 wafers. If capacity further reaches 25,000 wafers per month, the annualized PIC output is projected to hit 194 million dies. (Jin10)