[Shanghai Lingang New Area Chip Port Integrated Wafer Manufacturing Project Officially Commences] According to Golden Finance, on June 30, the groundbreaking ceremony for the Lingang New Area Chip Port Integrated Project was officially held at the project site in Xinlu Village, Wanxiang Town, on June 29. Shanghai Oriental Chip Port Integrated Circuit Co., Ltd. was officially established in November 2025, with an initial registered capital of $5.5 billion, and plans for subsequent capital increases and equity expansions. The total construction area of Phase I of the Chip Port Integrated Project is approximately 620,000 square meters. Once completed, it will focus on the research, development, and manufacturing of integrated circuits using 55nm-28nm planar processes, providing foundry services for global clients. Phase I of the project is scheduled to begin construction in the third quarter of 2026 and be delivered for use by the end of 2027.