[Pulais: The Next Wave of Opportunities in Artificial Intelligence May Lie Further Upstream in the Supply Chain] Deep Tide TechFlow reports that on June 30, Pulais Group portfolio specialist Amanda Ng pointed out in a report that the next phase of investment opportunities related to artificial intelligence may emerge further upstream in the supply chain, rather than in the highly sought-after AI platforms or chip manufacturers. She highlighted that areas such as advanced packaging, semiconductor substrates, and high-end printed circuit boards (PCBs) are becoming increasingly critical. Although these components account for a relatively small proportion of the total bill of materials required for AI, they could still become key bottlenecks. She also mentioned that even a slight increase in the prices of these products could significantly boost manufacturers' profitability while remaining within an acceptable range for end customers. (Jin10)