[Applied Materials Launches Series of 3D Manufacturing Equipment for AI Chips Targeting HBM Stacking Process] Golden Finance reported that on June 30, Applied Materials unveiled a product line of three-dimensional (3D) chip manufacturing equipment designed for AI semiconductors. This series of equipment primarily focuses on advanced packaging processes such as High Bandwidth Memory (HBM), chiplets, and hybrid bonding, addressing needs for planarization, deposition, and metrology. Specifically, the newly launched equipment includes advanced Chemical Mechanical Polishing (CMP), Electrochemical Deposition (ECD), and Plasma-Enhanced Chemical Vapor Deposition (PECVD) devices for the packaging field. Additionally, it introduces new electron beam-based process control equipment and upgrades its epitaxy equipment used in DRAM processes.