[Qualcomm Plans to Introduce Data Center Chip Technology into Smartphones to Enhance On-Device AI Capabilities] According to a report by Jinse Finance, on June 27, Qualcomm Executive Vice President Durga Malladi stated that the company plans to apply its newly released data center chip technology to smartphones this week to enhance the local AI processing capabilities of mobile devices. Qualcomm's newly launched High Bandwidth Compute (HBC) architecture adopts a vertically stacked chip design, tightly integrating memory and compute units, which can significantly improve data transfer speed and efficiency. The first-generation product of this architecture will be introduced in data centers next year, with commercial availability expected by 2028. Malladi noted, 'The technology from data centers will not stop here,' adding that the company is currently in discussions with smartphone, personal computer, and automotive manufacturers regarding related technologies.