[Samsung Electro-Mechanics Mass Produces FC-BGA Package Substrates for Qualcomm, Extending Collaboration to Data Center Business] BlockBeats News, June 22 — Samsung Electro-Mechanics has begun mass production of package substrate products for Qualcomm's first data center AI accelerator at its Busan factory. This supply marks the expansion of their partnership from traditional mobile devices and PC sectors to the data center market. Samsung Electro-Mechanics recently initiated mass production of FC-BGA (Flip Chip Ball Grid Array) package substrates for Qualcomm's latest AI accelerator, "AI200." The "AI200" is Qualcomm's first AI accelerator designed for data centers, launched in October last year, primarily targeting AI inference scenarios. The chip features Qualcomm's self-developed "Oryon" CPU and "Hexagon" NPU, combined with low-power LPDDR5 memory to enhance energy efficiency. Qualcomm plans to release the AI200 in the second half of this year, prompting Samsung Electro-Mechanics to advance its FC-BGA mass production phase to align with the product launch timeline. This development signifies that their collaboration in the AI chip supply chain is accelerating toward the data center infrastructure domain. Click the original link below to join the Beating · Feishu AI News Channel for 24/7 global AI news and updates. [Original Link]