Intel CEO Chen Liwu's latest interview mentions several undervalued directions in the market In a recent interview with Intel CEO Chen Liwu, several new materials and resource directions worth paying attention to were mentioned. Please organize them and share my own judgment on how to view them. What impressed me the most during Chen Liwu's interview was his repeated mention of several underlying directions: SiC, GaN, Glass Core, and artificial diamonds that many people overlook. These directions may not seem sexy, but they point to the same problem: AI is shifting from combining computing power to combining connectivity, heat dissipation, materials, and electricity. In the future, the market will increasingly focus on who controls bottlenecks and who holds key materials. 1. InP (indium phosphide) Function: Optical module, optical communication, 800G/1.6T, AI data center interconnection Investment logic: The larger the AI cluster, the more important the optical interconnection. High speed lasers and next-generation optical engines are increasingly relying on InP materials. Preferred Stocks: Pure InP (AXTI), InP+Optical Device Leaders (COHR, LITE) 2. SiC (silicon carbide) Function: Electric vehicle, power management, AI data center power supply Investment logic: One of the biggest bottlenecks for AI is electricity. SiC improves power conversion efficiency and is an important material for the next generation of high-power systems. Preferred stocks: ON, STM High risk and high elasticity: WOLF 3. Glass Core (glass substrate) Function: Next generation packaging substrate, ultra large GPU packaging, HBM high-level stacking, high-frequency and high-speed signal transmission Investment logic: With GPUs getting bigger and HBM stacks getting higher, traditional ABF organic substrates are approaching their physical limits. Glass Core is considered an important foundational material for the next generation of advanced packaging due to its better flatness, lower coefficient of thermal expansion, and superior high-frequency signal performance. Preferred stock: GLW (Corning) 4. Gallium Nitride (GaN, Gallium Nitride) Function: AI data center power supply, 800V DC, power management, RF communication Investment logic: GaN belongs to the third generation of semiconductor materials, with a wider bandgap, higher breakdown electric field, and higher switching frequency. Compared to traditional silicon devices, GaN can achieve higher power conversion efficiency, smaller size, and lower energy consumption, so it is gradually entering AI servers, power modules, and next-generation data center power supply architectures. Preferred stocks: NVTS, POWI, IFNNY (ADR) 5. Artificial diamonds This is something many people overlook. Function: GPU cooling, ASIC packaging, high-frequency optical components Investment logic: AI chips are becoming increasingly popular, and heat dissipation is becoming a new bottleneck. Artificial diamonds have thermal conductivity far exceeding that of copper, and are expected to be used for heat dissipation in high-power chips such as GPUs and ASICs, and even for thermal management of some high-end optical devices in the future. But currently, costs and processes are still limitations, and it is more like a new material direction that deserves special attention after 2030. Preferred stocks: Most of them are A-share companies, strictly speaking, there are no particularly pure US stock targets. If sorted by my own investment priority: Glass Core ≈ InP>SiC (power)>GaN (gallium nitride)>synthetic diamond