[TrendForce: TSMC Accelerates CoPoS Development, Glass Substrates May Achieve Mass Production After 2030] BlockBeats News, June 17 — According to the latest report from TrendForce, the rapid growth in demand for AI semiconductors is driving the evolution of advanced packaging technologies, with fan-out panel-level packaging (FOPLP) becoming a new battleground in the industry. TSMC is currently focusing on the CoPoS packaging architecture and has standardized the use of the 310 × 310 mm panel format. It is expected that 2026 will be a critical validation period for related equipment and material suppliers, with trial production targeted for 2027 and mass production anticipated in the second half of 2028. Beyond CoPoS, TSMC's next phase of focus is expected to shift toward glass core substrates, with commercial-scale production likely to occur after 2030. [Original Link]