China has successfully developed three-dimensional multi-layer on-chip capacitors that can be directly applied to high-end chips such as AI/GPU chips and high-performance processors According to a report by Golden Finance on June 12th, according to the Jiangcheng Laboratory in Hubei Province, the laboratory has recently made significant breakthroughs in key capacitor technologies, successfully developing three-dimensional multilayer on-chip capacitors with a capacitance density exceeding 1000 nanofarads per square millimeter. This capacitor can be directly applied to high-end chips such as AI/GPU chips and high-performance processors, supporting the development of high computing power and low-power chips. At present, relevant technologies are undergoing process flow and small-scale trial production, and will be applied on a large scale in the field of advanced packaging. The role of capacitors in circuits is essentially a miniature "reservoir": when the chip current fluctuates violently, it can quickly charge and discharge to stabilize the voltage, ensuring that the chip receives a "pure and stable" current. Capacitors are also metaphorically referred to as "electric RAM" in computing power systems: HBM is the data buffer for computing power, while capacitors are the energy buffer for computing power. To supply power when the GPU is instantly fully powered, it is necessary to rely on multi-level power caching from nanoseconds to seconds to relay power step by step.