[TSMC CEO: CoPoS Advanced Packaging Running on Pilot Production Line, Output Expected to Increase Significantly in the Next Two to Three Years] Odaily Planet Daily News - According to tech analyst @jukan05, TSMC's CEO stated that the company's CoPoS advanced packaging technology is now operational on a pilot production line, with production volume expected to increase significantly over the next two to three years. He also mentioned that TSMC is expanding mature process wafer capacity, including a wafer fab in Japan to meet CMOS image sensor demand and a wafer fab in Germany to support automotive and industrial needs. Meanwhile, the company has no intention of implementing significant price hikes like those seen in the memory semiconductor industry, instead focusing on long-term, sustainable growth rather than short-term price increases.